(주)원익

Introduction

What is HIC (Hybrid Integrated Circuit),

It is a type of electronic component manufactured to have a certain electrical function by forming a circuit on a substrate made of an insulator through a thick film or thin film process, and then mounting various passive elements and active elements. To protect the product, resin, phenol, or other coating materials used to cover the exterior in the form of molding, or a material such as polymer or glass may be used. The shape of the terminal is determined according to the customer's specifications, and it formed to a lead frame, wire, or pin.

**Fig. Typical Materials and Process used to fabricate interconnection substrate**
Base substrate	Al2O3, AlN, BeO
Conductors	Au, Pt/Au Ag, Pd/Ag, Pt/Ag Pt/Pd/Ag, Cu
Dielectrics	Glass-ceramics, recrystallizing glasses
Resistors	RuO2 doped glass
Processes	Sequentially print, dry, and fire conductor, Dielectric, and resistor pastes

Excellent reliability and electrical features.
High density & Reliability
Can be applied to a variety of assembly technology such as BGA, MCM, COB COF, COM, COS.,
High power & voltage
High frequency range
Easy modulation

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