(주)원익

Laser Scribing

• Substrate (Al2O3 96%)
  • Dielectric constant (1MHz): 9.5
  • Volume Resistivity(25 deg C)>1014 ohms-cm
  • Size: Max 5.0" x 7.0"
  • Thickness: 0.015" ~ 0.05"
• Scribing Ability
  • Thickness: 0.010" to 0.060"
  • Size: 7.0" sq. Max
• Hole Cutting Ability
  • Diameter: Min 0.006"

Screen Printing & Firing

• Print Area
  • Substrate size : Max 6” X 6”
• Fine Line Print
  • General conductor paste: 3 mils line & 3 mils space
  • Au: 2 mils line & 2 mils space
• Through Hole, Slot Hole & Edge Print
  • Through hole: Min Φ 0.006"
  • Slot hole: Min Φ 0.006"
  • All kinds of edge print
• Multi Layer Print
  • Single side print: 7 layers
  • Double side print: 6 layers (Each side)

Laser Trimming

• Trim Methods
  • Passive trim
  • Active trim (Current,Voltage,Frequency)
  • Ratio trim
  • Capacitance trim
• Accuracy
  • Passive trim tolerance: +/- 0.02%
  • Ratio trim tolerance: +/- 0.1%
  • Active trim tolerance: +/- 0.05%
• Excellent Repeatability

SMT / DIE BONDING

• SMT
  • Available Chip Size: 0201 Size
  • Melf Type: 1.6 x 0.8 Dia
  • PLCC: ~ 100 pins
  • QFP: ~ 100 pins / 0.65mm Pitch
  • Maximum Components Thickness: 10mm
  • Maximum Board Size: 330 x 250mm
• DIE BONDER
  • Available Types: Dispensing, Stamping, Dotting
  • Die Size: 0.5mm x 0.5mm ~ 35mm x 35mm
  • Accuracy: +/-12um
  • QFP: ~ 100 pins / 0.65mm Pitch
  • Work Area: 50mm x 50mm ~ 200mm x 200mm
  • Speed: 1.0sec/chip (UPH:3600)

WIRE BONDING

• Au wire
  • Standard Substrate size : 4”x6”, 4”x4” typical
  • Bonding Type : Thermo sonic Ball bonding
  • Wire diameter : 0.8 ~ 2.0 mils Typical
• Al wire
  • Standard Substrate size : 4”x4” typical
  • Bonding Type : Ultrasonic wedge bonding
  • Wire diameter : 4~20mils